Kuo: Apple Delays Change Aimed at Saving Space Inside Future iPhones

Kuo: Apple Delays Change Aimed at Saving Space Inside Future iPhones Apple no longer plans to use resin-coated copper for logic boards in iPhone 17 models next year, supply chain analyst Ming-Chi Kuo said today.
Kuo said resin-coated copper failed to meet Apple's "high-quality requirements," leading to the company scrapping its plans to adopt the material for iPhone 17 models. It is unclear if Apple will revisit...

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