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Apple Looking to Save Space in Future iPhones With Thinner Circuit Boards
Apple Looking to Save Space in Future iPhones With Thinner Circuit Boards Apple will begin using a new material to make its printed circuit boards thinner starting next year, according to a source with a good track record.
Apple will reportedly switch to using resin coated copper (RCC) foil as a new printed circuit board (PCB) material in 2024. The change will apparently allow Apple to make its PCBs even thinner. Cur...
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